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How can a chip inductor plate placing machine reduce the impact of static electricity during the placement process?

Publish Time: 2025-11-04
During the chip inductor plate placing process, static electricity can severely impact mounting accuracy and product quality by attracting dust, damaging components, and interfering with equipment. To reduce the impact of static electricity, a comprehensive protection system needs to be built from multiple dimensions, including environmental control, equipment design, material selection, and operating procedures.

Ambient humidity is a key factor affecting static electricity generation. Dry environments accelerate charge accumulation, while appropriately increasing humidity can enhance air conductivity and promote natural dissipation of static electricity. It is generally recommended to control workshop humidity within the range of 40%-70%, which can be achieved in dry northern regions using humidifiers. At the same time, excessive humidity should be avoided to prevent components from becoming damp; this requires dynamic adjustment using moisture-proof packaging and a temperature and humidity monitoring system. Temperature control is equally important; excessively high or low temperatures can exacerbate static electricity problems and need to be managed in conjunction with humidity to maintain a stable production environment.

Equipment grounding is the core measure for eliminating static electricity. Chip inductor plate placing machines must use an independent grounding system to conduct static electricity to the earth, with a grounding resistance of less than 10Ω. For precision equipment, a soft grounding method with a 1MΩ resistor in series can be used to prevent current surges from damaging components. Metal components such as equipment casings and electrostatic shielding covers must be directly and hard-grounded to ensure rapid dissipation of static charge. Furthermore, transmission devices should minimize belt slippage, prioritizing the use of conductive tape or V-belts to prevent static electricity generation due to friction.

The application of anti-static materials is crucial throughout the entire production process. Workbenches must be covered with anti-static mats, floors must be anti-static flooring, and operator chairs must be conductive. Anti-static packaging materials such as anti-static bags and foam prevent the accumulation of static electricity in components during transportation and storage. For sensitive components such as chip inductors, anti-static trays and turnover boxes with surface resistance meeting standards must be used to reduce the risk of static electricity during handling.

Ion fans are an effective tool for localized static electricity elimination. Installing ion fans in areas prone to static accumulation, such as component conveyor tracks and chip mounters, generates positive and negative ions to neutralize static charge. Their working principle involves ionizing air molecules, causing ions to actively adsorb the charge on the surface of static objects, achieving rapid dissipation. Ion emitters must be cleaned regularly and ion balance checked to ensure continuous and effective equipment operation. For areas where static electricity cannot be eliminated through grounding, ion fans can provide supplementary protection.

Operators are a crucial link in electrostatic discharge (ESD) protection. Before entering the workshop, operators must wear anti-static work clothes, anti-static shoes, and anti-static wrist straps to conduct static electricity away from the body through conductive fibers. The anti-static wrist straps must maintain good contact with the skin, and their resistance value should be checked regularly. During operation, avoid rapid movement or friction to reduce the generation of static electricity on the body. Before touching components, discharge static electricity by touching a grounded metal object or cleaning hands with an anti-static eliminator. Furthermore, regular ESD protection training is essential to reinforce awareness of standardized operating procedures.

Process control is the fundamental means of preventing ESD. In material selection, components and auxiliary materials with excellent anti-static properties should be prioritized. During installation, the friction speed of components must be controlled to avoid generating static electricity through high-speed movement. In terms of operational management, a strict ESD protection process must be established, such as setting up ESD detection points in key areas like component storage areas and mounting areas to monitor ESD potential in real time. When the ESD potential exceeds the safe threshold, the system will automatically alarm and suspend production until the problem is resolved.

Regular maintenance and inspection are the foundation for ensuring the effectiveness of the protection system. A detailed equipment maintenance plan needs to be developed, and the performance of equipment such as grounding systems, ion fans, and anti-static materials should be checked regularly. Static electricity detection instruments should be used to monitor key areas in real time and record the trend of static electricity potential changes. Any problems discovered must be rectified immediately, and the cause traced to prevent similar problems from recurring. By continuously optimizing protective measures, the impact of static electricity on the chip inductor plate placing machine process can be significantly reduced, improving product quality and production efficiency.
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