Common causes of component damage during chip inductor plate placing machine (CIPM) mounting include mechanical stress damage, soldering thermal shock, electrostatic discharge, equipment precision deviations, and improper process parameters. To avoid these problems, a multi-dimensional protective system needs to be built, encompassing equipment maintenance, process optimization, environmental control, and operational procedures.
Mechanical stress is the primary factor leading to chip inductor damage. During high-speed movement of the CIPM, excessive nozzle pressure or improper mounting height can apply excessive mechanical stress to components, causing lead bending, package cracking, or internal structural damage. For example, surface-mount common-mode inductors may crack due to excessive pressure during mounting, or be damaged by thermal expansion due to improper pad layout. Therefore, it is necessary to regularly calibrate the CIPM nozzle pressure and mounting height to ensure they match component specifications; simultaneously, a gentle mounting mode should be used for precision components to reduce mechanical shock. In addition, wear and tear on mechanical parts of the equipment can indirectly lead to component damage. For example, loose guide rails can cause deviations in the movement trajectory, requiring regular lubrication and tightening to ensure equipment stability.
Thermal shock during the soldering process is another critical risk source. During reflow soldering, high temperatures can cause degradation of the internal material properties of chip inductors, such as core demagnetization, uneven solder ball melting, or cracking, leading to poor contact or short circuits. For example, the inductance of a low-frequency surface-mount power inductor may increase after reflow soldering due to demagnetization, affecting circuit performance. To reduce thermal shock, the soldering temperature profile needs to be optimized to ensure a gentle temperature gradient during preheating, heating, reflow, and cooling, avoiding rapid heating and cooling. Simultaneously, appropriate solder and soldering time should be selected based on the component's solderability to prevent overheating and component failure.
The threat of electrostatic discharge (ESD) to chip inductors cannot be ignored. Static energy carried by the human body or tools can break down sensitive internal structures of components, such as oxide layers or transistors, causing functional failure. For example, tiny chips are easily damaged by static electricity accumulation in dry environments. Therefore, a complete ESD protection system needs to be established, including wearing anti-static wrist straps, using anti-static workbenches and tools, ensuring proper grounding of the operating environment, and deploying electrostatic monitoring instruments at key positions to monitor grounding status in real time.
Equipment accuracy deviations and improper process parameters directly affect placement quality. Insufficient repeatability of the mechanical motion system of a chip inductor plate placing machine may lead to component misalignment or poor soldering; while unreasonable settings of parameters such as placement speed and nozzle pressure may cause component damage or soldering defects. For example, small-sized components require a low-pressure, low-speed placement mode, while large components require increased nozzle pressure to ensure stability. Therefore, the mechanical components and vision recognition system of the chip inductor plate placing machine need to be calibrated regularly to ensure their accuracy meets requirements; at the same time, process parameters should be optimized according to component type and package form, and the optimal parameter combination should be verified through experiments.
Environmental control is crucial to ensuring placement quality. Dust, moisture, and other contaminants may adhere to the component surface or enter the equipment, causing electrical short circuits or optical recognition errors. For example, dust entering the guide rails of a chip inductor plate placing machine can cause movement jamming, affecting placement accuracy. Therefore, it is necessary to maintain a cleanroom environment in the SMT workshop and regularly clean the equipment and working environment; at the same time, temperature and humidity must be controlled within a suitable range to prevent components from becoming damp or accumulating static electricity. Furthermore, the storage and use environment of materials must be strictly managed, such as storing electronic components in a constant temperature and humidity environment to prevent pin oxidation or package aging.
Following operating procedures is the last line of defense against component damage. Operators must receive professional training and be familiar with equipment operating procedures and safety precautions, such as checking the feeder status before loading and preventing foreign objects from entering the movement range during placement. Simultaneously, a strict quality inspection mechanism must be established, utilizing automated optical inspection (AOI) and X-ray inspection equipment to comprehensively inspect placement positions, solder joint quality, etc., to promptly identify and address problems and prevent defective products from flowing to the next process.
